甲骨文带动，A股市场看多可期

今日市场量能24377亿，较昨日放量4596亿，上涨家数4029家，涨停87家。美股甲骨文继续大涨，带动A股科技股。上证修复到箱体上沿，创业板突破箱体站上3000点，中大盘股为修复主要力量。情绪上，高位买盘力量随创业板修复维持，整体风偏未降太多。后续可关注AI硬件、机器人及固态电池方向硬核逻辑，大金融也可留意。日内强势板块包括PCB/CPO/铜连接、芯片/算力、机器人等，还有绿色甲醇这一新面孔，相关多股表现活跃。消息面上，甲骨文预计云基础设施营收大增，NVIDIA推出新芯片，特斯拉谈及机器人进展，金风科技加大绿醇投资。

股票名称 ["工业富联","胜宏科技","青山纸业","东山精密","景旺电子","东方通信","东材科技","金安国纪","方正科技","宏和科技","剑桥科技","世嘉科技","崇达技术","中京电子","徕木股份","通鼎互联","兴森科技","生益科技","澳弘电子","沪电股份","华工科技","深南电路","江南新材","鹏鼎控股","大族激光","立讯精密","沃尔核材","四会富仕","奕东电子","腾景科技","鼎泰高科","金信诺","淳中科技","新炬网络","凤凰光学","万通发展","兆易创新","荣联科技","中科曙光","罗曼股份","良信股份","白云","易德龙","海光信息","赛微微电","新相微","香浓芯创","新时达","艾华集团","兆威机电","宝武镁业","嘉泽新能","航天工程","东华科技","中国天楹","复洁环保","东财"]板块名称 ["AI硬件","机器人","固态电池","PCB/CPO/铜连接","芯片/算力","绿色甲醇"] 甲骨文大涨、创业板新高、AI硬件修复看多看空（看多） 美股甲骨文继续大幅超预期，带动A股AI硬件持续修复以及高位能量回归。今日市场量能较昨日放量，上涨家数多于下跌家数，涨停家数多，跌停家数少。指数上，上证修复到箱体上沿，创业板突破箱体站上3000点。情绪上，高位买盘力量维持，整体风偏没下降很多。创业板再创新高，科技权重强力修复，后续多个板块处于上升阶段，所以看多A股。站上3000点！和讯自选股写手风险提示：以上内容仅作为作者或者嘉宾的观点，不代表和讯的任何立场，不构成与和讯相关的任何投资建议。在作出任何投资决定前，投资者应根据自身情况考虑投资产品相关的风险因素，并于需要时咨询专业投资顾问意见。和讯竭力但不能证实上述内容的真实性、准确性和原创性，对此和讯不做任何保证和承诺。

本文由 AI 算法生成，仅作参考，不涉投资建议，使用风险自担